※ We perform detailed glass cutting using high-precision dicing equipments. ※ We produce and process very reliable parts by preventing particle and progressive crack through embodying 4 chambers for each surface. ※ We provide process control of particle under 20um using the semiconductor cleaning process
※ Assembled in 10 Class room to maintain very clean surface. ※ Provides IR Filter Ass'y of CSP, COB, COF types.
